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SMT Capability

As industry pioneers, we uphold our reputation with comprehensive in-house PCB manufacturing and rapid prototyping and assembly services.

Introduction

  • SMT Capacity

  • Rigid PCB Capacity

  • Flex PCB Capacity

  • Metal PCB Capacity

At the forefront of electronic manufacturing, we offer comprehensive Surface Mount Technology (SMT) assembly services with a robust set of capabilities to meet diverse production needs:

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  • Single and Double-Sided SMT/PTH: Expertise in assembling both single and double-sided surface mount and through-hole (PTH) components.

  • Handling Large and Small Parts: Capable of assembling large components on both sides of the PCB and accommodating Ball Grid Arrays (BGAs) with pitches as fine as 0.008 inches (0.2 mm) and ball counts exceeding 1000.

  • Component Size and Pitch: Supports assembly of the smallest chip sizes down to 0201 and leaded parts with pitches as fine as 0.008 inches (0.2 mm).

  • Max Assembly Size: Our machines can handle parts up to 2.2 inches x 2.2 inches x 0.6 inches.

  • Versatile Assembly: Efficiently assembles surface mount connectors, odd form parts such as LEDs, resistor and capacitor networks, electrolytic capacitors, variable resistors and capacitors (pots), and sockets.

  • Wave Soldering: Capable of wave soldering to ensure robust connections for various component types.

  • PCB Specifications: Accommodates PCBs up to 14.5 inches x 19.5 inches with a minimum thickness of 0.02 inches.

  • Fiducial Marks: Preferred but not required for precise alignment.

  • PCB Finishes: Offers a variety of finishes including SMOBC/HASL, electrolytic gold, electroless gold, electroless silver, immersion gold, immersion tin, and OSP.

  • PCB Shapes: Capable of working with any PCB shape.

  • Panelized PCBs: Handles various panelization methods including tab-routed, breakaway tabs, V-scored, and routed + V-scored panels.

  • Inspection and Rework: Utilizes advanced inspection methods such as X-ray analysis and microscopes up to 20X magnification. Provides comprehensive rework capabilities including BGA removal and replacement, SMT IR rework, and through-hole rework.

  • Min IC Pitch and Solder Paste Printing: Capable of handling IC pitches down to 0.2 mm and printing solder paste at 0.2 mm.

  • POP Manufacturing: Equipped for Package-on-Package (POP) manufacturing with a 3F capability.

 

Our SMT assembly capabilities ensure precision, flexibility, and reliability, supporting a wide range of complex and high-quality electronic assemblies.

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