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Versatile Rigid-Flexible PCBs: Perfect for High-Density Designs

    • Versatile Rigid-Flexible PCBs: Perfect for High-Density Designs

    Rigid-Flexible PCBs (Printed Circuit Boards) combine the best features of rigid and flexible circuit boards, providing both stability and flexibility in one integrated design. They consist of a rigid section and a flexible section, allowing them to be used in applications where both characteristics are needed.
    Key Features:
    • Hybrid Design: Combines rigid and flexible layers to offer both structural support and the ability to bend or twist.
    • Space Efficiency: Ideal for compact and complex designs where space is at a premium.
    • Enhanced Durability: Flexible sections can withstand vibrations and mechanical stress, while rigid sections provide stability and protection for sensitive components.
    • Versatile Applications: Suitable for use in a variety of industries including consumer electronics, automotive, medical devices, and aerospace.
    Benefits:
    • Improved Reliability: Reduces the risk of solder joint failure and mechanical stress by incorporating flexible sections.
    • Design Flexibility: Allows for more compact and creative designs by accommodating complex shapes and configurations.
    • Reduced Assembly Complexity: Minimizes the need for additional connectors and interconnects, streamlining the assembly process.

    • PRODUCT INFO

       

      1. Rigid Substrate Materials:

      FR-4: A commonly used material made of woven glass fabric and epoxy resin. It provides good mechanical strength and thermal stability.

      Thickness: Typically ranges from 0.4 mm to 3.2 mm.

      Thermal Rating: Up to 130°C.

      Dielectric Constant: Approximately 4.5.

      High-Frequency Materials: Such as Rogers or Taconic laminates, used in applications requiring superior signal integrity.

      Thickness: Varies based on application, typically around 0.8 mm to 2.0 mm.

      Thermal Rating: Up to 180°C or higher.

      Dielectric Constant: Ranges from 2.2 to 10.0, depending on the material.

      2. Flexible Substrate Materials:

      Polyimide (PI): A high-performance polymer known for its excellent thermal stability, flexibility, and chemical resistance.

      1. Thickness: Generally between 0.05 mm to 0.2 mm.
      2. Thermal Rating: Up to 250°C.
      3. Dielectric Constant: Approximately 3.0 to 3.5.

      Polyester (PET): Another flexible material offering good mechanical properties and lower cost compared to polyimide.

      • Thickness: Typically ranges from 0.1 mm to 0.2 mm.
      • Thermal Rating: Up to 150°C.
      • Dielectric Constant: Approximately 3.2 to 3.5.

      3. Conductive Materials:

      Copper Foil: Used for the conductive layers in both rigid and flexible sections.

      1. Thickness: Standard thicknesses include 1 oz/ft² (35 µm) to 2 oz/ft² (70 µm).
      2. Adhesion: Ensured by specialized bonding techniques, particularly in flexible sections.

      4. Adhesives and Bonding Materials:

      Polyimide Adhesives: Used to bond the flexible and rigid sections, offering high thermal and chemical resistance.

      1. Bonding Temperature: Typically requires curing at temperatures between 150°C to 250°C.
      2. Acrylic or Epoxy Adhesives: Used for certain applications where specific bonding characteristics are required.
        • Bonding Temperature: Curing temperatures generally range from 80°C to 150°C.

      5. Solder Mask and Surface Finishes:

      Solder Mask: Protects the PCB and prevents solder from bridging between traces.

      1. Types: Typically available in green, black, or other colors, and can be applied to both rigid and flexible sections.
      2. Surface Finishes: Ensures good solderability and protection of exposed copper.

      Options: Hot Air Solder Leveling (HASL), Electroless Nickel/Immersion Gold (ENIG), Organic Solderability Preservative (OSP), and others based on the application.

    • APPLICATIONS

      Common Applications:

      1. Consumer Electronics: Used in smartphones, tablets, wearables, and other compact devices requiring both flexibility and durability.
      2. Automotive: Employed in complex dashboard assemblies, infotainment systems, and sensor modules.
      3. Medical Devices: Ideal for portable diagnostic equipment, implants, and flexible medical sensors.
      4. Aerospace: Suitable for avionics systems, satellite components, and other high-reliability applications.

       

      Notes:

      Design Considerations: Ensure proper design of flex-to-rigid transitions to avoid mechanical failure. Manufacturing: Requires specialized processes and materials to achieve optimal performance and reliability. Testing and Quality Control: Comprehensive testing is essential to ensure the integrity and performance of both rigid and flexible sections.

      Advantages:

      Enhanced Reliability: Reduces mechanical stress and solder joint failures with flexible connections. Design Flexibility: Allows for intricate and space-efficient designs that traditional rigid boards cannot achieve. Reduced Assembly Complexity: Integrates multiple functions into a single board, minimizing the need for additional connectors and reducing assembly time.

    • SHIPPING INFO

      Delivery Time:
      * 10 pieces: 14 days
      * 600 pieces: 19 days
      * 3000 pieces: 24 days

      Packaging: Hard carton with bubble wrap, vacuum-sealed polybags
      Sample Service: $0.4 each, customer covers delivery costs
      Dimensions: 18 cm x 16 cm x 12 cm
      Weight: 0.05 kg
      Custom Orders: Available for 50+ pieces
      Sunsoar is a professional PCB/PCBA factory offering high-quality, reliable products tailored to your needs. Contact us for details and custom orders.

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