Introduction
A multilayer printed circuit board (PCB) consists of two or more conductive copper layers separated by dielectric materials like FR-4. These PCBs enhance component density by allowing placement on both sides and internally buried layers, making them ideal for complex digital circuits, RF/microwave systems, high-speed computing, and other applications requiring high interconnectivity.
This article provides an in-depth overview of multilayer PCB technology, covering:
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Multilayer PCB manufacturing processes
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Materials and construction
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Key design considerations
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Modeling and analysis
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Thermal management
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Signal integrity
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Cost tradeoffs
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Reliability factors
Understanding multilayer PCB capabilities and design best practices is essential for leveraging their benefits in electronic product development.