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다양한 강성-유연성 PCB: 고밀도 설계에 적합

    • 다양한 강성-유연성 PCB: 고밀도 설계에 적합

    강성-유연성 PCB(인쇄 회로 기판)는 강성 및 유연 회로 기판의 가장 뛰어난 특징을 결합하여 하나의 통합된 설계로 안정성과 유연성을 모두 제공합니다. 강성 섹션과 유연 섹션으로 구성되어 있어 두 가지 특성이 모두 필요한 애플리케이션에 사용할 수 있습니다.
    주요 특징:
    하이브리드 설계: 강성 및 유연 레이어를 결합하여 구조적 지지와 굽힘 또는 비틀림 기능을 모두 제공합니다.
    공간 효율성: 공간이 매우 부족한 컴팩트하고 복잡한 설계에 이상적입니다.
    향상된 내구성: 유연 섹션은 진동과 기계적 응력을 견딜 수 있는 반면, 강성 섹션은 민감한 구성 요소에 안정성과 보호 기능을 제공합니다.
    다양한 응용 분야: 가전 제품, 자동차, 의료 기기 및 항공 우주를 포함한 다양한 산업에서 사용하기에 적합합니다.
    이점:
    향상된 신뢰성: 유연 섹션을 통합하여 솔더 접합부 고장 및 기계적 응력의 위험을 줄입니다.
    설계 유연성: 복잡한 모양과 구성을 수용하여 보다 컴팩트하고 창의적인 설계를 가능하게 합니다.
    조립 복잡성 감소: 추가 커넥터와 상호 연결의 필요성을 최소화하여 조립 프로세스를 간소화합니다.

    • 제품 정보

       

      1. Rigid Substrate Materials:

      FR-4: A commonly used material made of woven glass fabric and epoxy resin. It provides good mechanical strength and thermal stability.

      Thickness: Typically ranges from 0.4 mm to 3.2 mm.

      Thermal Rating: Up to 130°C.

      Dielectric Constant: Approximately 4.5.

      High-Frequency Materials: Such as Rogers or Taconic laminates, used in applications requiring superior signal integrity.

      Thickness: Varies based on application, typically around 0.8 mm to 2.0 mm.

      Thermal Rating: Up to 180°C or higher.

      Dielectric Constant: Ranges from 2.2 to 10.0, depending on the material.

      2. Flexible Substrate Materials:

      Polyimide (PI): A high-performance polymer known for its excellent thermal stability, flexibility, and chemical resistance.

      1. Thickness: Generally between 0.05 mm to 0.2 mm.
      2. Thermal Rating: Up to 250°C.
      3. Dielectric Constant: Approximately 3.0 to 3.5.

      Polyester (PET): Another flexible material offering good mechanical properties and lower cost compared to polyimide.

      • Thickness: Typically ranges from 0.1 mm to 0.2 mm.
      • Thermal Rating: Up to 150°C.
      • Dielectric Constant: Approximately 3.2 to 3.5.

      3. Conductive Materials:

      Copper Foil: Used for the conductive layers in both rigid and flexible sections.

      1. Thickness: Standard thicknesses include 1 oz/ft² (35 µm) to 2 oz/ft² (70 µm).
      2. Adhesion: Ensured by specialized bonding techniques, particularly in flexible sections.

      4. Adhesives and Bonding Materials:

      Polyimide Adhesives: Used to bond the flexible and rigid sections, offering high thermal and chemical resistance.

      1. Bonding Temperature: Typically requires curing at temperatures between 150°C to 250°C.
      2. Acrylic or Epoxy Adhesives: Used for certain applications where specific bonding characteristics are required.
        • Bonding Temperature: Curing temperatures generally range from 80°C to 150°C.

      5. Solder Mask and Surface Finishes:

      Solder Mask: Protects the PCB and prevents solder from bridging between traces.

      1. Types: Typically available in green, black, or other colors, and can be applied to both rigid and flexible sections.
      2. Surface Finishes: Ensures good solderability and protection of exposed copper.

      Options: Hot Air Solder Leveling (HASL), Electroless Nickel/Immersion Gold (ENIG), Organic Solderability Preservative (OSP), and others based on the application.

    • 응용 프로그램

      Common Applications:

      1. Consumer Electronics: Used in smartphones, tablets, wearables, and other compact devices requiring both flexibility and durability.
      2. Automotive: Employed in complex dashboard assemblies, infotainment systems, and sensor modules.
      3. Medical Devices: Ideal for portable diagnostic equipment, implants, and flexible medical sensors.
      4. Aerospace: Suitable for avionics systems, satellite components, and other high-reliability applications.

       

      Notes:

      Design Considerations: Ensure proper design of flex-to-rigid transitions to avoid mechanical failure. Manufacturing: Requires specialized processes and materials to achieve optimal performance and reliability. Testing and Quality Control: Comprehensive testing is essential to ensure the integrity and performance of both rigid and flexible sections.

      Advantages:

      Enhanced Reliability: Reduces mechanical stress and solder joint failures with flexible connections. Design Flexibility: Allows for intricate and space-efficient designs that traditional rigid boards cannot achieve. Reduced Assembly Complexity: Integrates multiple functions into a single board, minimizing the need for additional connectors and reducing assembly time.

    • 배송 정보

      Delivery Time:
      * 10 pieces: 14 days
      * 600 pieces: 19 days
      * 3000 pieces: 24 days

      Packaging: Hard carton with bubble wrap, vacuum-sealed polybags
      Sample Service: $0.4 each, customer covers delivery costs
      Dimensions: 18 cm x 16 cm x 12 cm
      Weight: 0.05 kg
      Custom Orders: Available for 50+ pieces
      Sunsoar is a professional PCB/PCBA factory offering high-quality, reliable products tailored to your needs. Contact us for details and custom orders.

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