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多用途のリジッドフレキシブル PCB: 高密度設計に最適

    • 多用途のリジッドフレキシブル PCB: 高密度設計に最適

    リジッドフレキシブル PCB (プリント回路基板) は、リジッド回路基板とフレキシブル回路基板の最高の機能を組み合わせたもので、1 つの統合設計で安定性と柔軟性の両方を実現します。リジッド セクションとフレキシブル セクションで構成されているため、両方の特性が必要なアプリケーションで使用できます。

    主な機能:
    ハイブリッド設計: リジッド層とフレキシブル層を組み合わせて、構造サポートと曲げやねじり機能の両方を提供します。
    スペース効率: スペースが貴重なコンパクトで複雑な設計に最適です。
    耐久性の向上: フレキシブル セクションは振動や機械的ストレスに耐えることができ、リジッド セクションは敏感なコンポーネントに安定性と保護を提供します。
    多用途: 民生用電子機器、自動車、医療機器、航空宇宙など、さまざまな業界での使用に適しています。
    利点:
    信頼性の向上: フレキシブル セクションを組み込むことで、はんだ接合部の故障や機械的ストレスのリスクを軽減します。
    設計の柔軟性: 複雑な形状や構成に対応することで、よりコンパクトでクリエイティブな設計が可能になります。
    組み立ての複雑さの軽減: 追加のコネクタや相互接続の必要性を最小限に抑え、組み立てプロセスを合理化します。

    • 製品情報

       

      1. Rigid Substrate Materials:

      FR-4: A commonly used material made of woven glass fabric and epoxy resin. It provides good mechanical strength and thermal stability.

      Thickness: Typically ranges from 0.4 mm to 3.2 mm.

      Thermal Rating: Up to 130°C.

      Dielectric Constant: Approximately 4.5.

      High-Frequency Materials: Such as Rogers or Taconic laminates, used in applications requiring superior signal integrity.

      Thickness: Varies based on application, typically around 0.8 mm to 2.0 mm.

      Thermal Rating: Up to 180°C or higher.

      Dielectric Constant: Ranges from 2.2 to 10.0, depending on the material.

      2. Flexible Substrate Materials:

      Polyimide (PI): A high-performance polymer known for its excellent thermal stability, flexibility, and chemical resistance.

      1. Thickness: Generally between 0.05 mm to 0.2 mm.
      2. Thermal Rating: Up to 250°C.
      3. Dielectric Constant: Approximately 3.0 to 3.5.

      Polyester (PET): Another flexible material offering good mechanical properties and lower cost compared to polyimide.

      • Thickness: Typically ranges from 0.1 mm to 0.2 mm.
      • Thermal Rating: Up to 150°C.
      • Dielectric Constant: Approximately 3.2 to 3.5.

      3. Conductive Materials:

      Copper Foil: Used for the conductive layers in both rigid and flexible sections.

      1. Thickness: Standard thicknesses include 1 oz/ft² (35 µm) to 2 oz/ft² (70 µm).
      2. Adhesion: Ensured by specialized bonding techniques, particularly in flexible sections.

      4. Adhesives and Bonding Materials:

      Polyimide Adhesives: Used to bond the flexible and rigid sections, offering high thermal and chemical resistance.

      1. Bonding Temperature: Typically requires curing at temperatures between 150°C to 250°C.
      2. Acrylic or Epoxy Adhesives: Used for certain applications where specific bonding characteristics are required.
        • Bonding Temperature: Curing temperatures generally range from 80°C to 150°C.

      5. Solder Mask and Surface Finishes:

      Solder Mask: Protects the PCB and prevents solder from bridging between traces.

      1. Types: Typically available in green, black, or other colors, and can be applied to both rigid and flexible sections.
      2. Surface Finishes: Ensures good solderability and protection of exposed copper.

      Options: Hot Air Solder Leveling (HASL), Electroless Nickel/Immersion Gold (ENIG), Organic Solderability Preservative (OSP), and others based on the application.

    • アプリケーション

      Common Applications:

      1. Consumer Electronics: Used in smartphones, tablets, wearables, and other compact devices requiring both flexibility and durability.
      2. Automotive: Employed in complex dashboard assemblies, infotainment systems, and sensor modules.
      3. Medical Devices: Ideal for portable diagnostic equipment, implants, and flexible medical sensors.
      4. Aerospace: Suitable for avionics systems, satellite components, and other high-reliability applications.

       

      Notes:

      Design Considerations: Ensure proper design of flex-to-rigid transitions to avoid mechanical failure. Manufacturing: Requires specialized processes and materials to achieve optimal performance and reliability. Testing and Quality Control: Comprehensive testing is essential to ensure the integrity and performance of both rigid and flexible sections.

      Advantages:

      Enhanced Reliability: Reduces mechanical stress and solder joint failures with flexible connections. Design Flexibility: Allows for intricate and space-efficient designs that traditional rigid boards cannot achieve. Reduced Assembly Complexity: Integrates multiple functions into a single board, minimizing the need for additional connectors and reducing assembly time.

    • 配送情報

      納期:

      * 10 個: 14 日

      * 600 個: 19 日

      * 3000 個: 24 日

      パッケージ: 気泡緩衝材付きハードカートン、真空密封ポリバッグ

      サンプル サービス: 1 個あたり 0.4 ドル、配送費用はお客様負担

      寸法: 18 cm x 16 cm x 12 cm

      重量: 0.05 kg

      カスタム オーダー: 50 個以上から対応可能

      Sunsoar は、お客様のニーズに合わせた高品質で信頼性の高い製品を提供するプロの PCB/PCBA 工場です。詳細とカスタム オーダーについてはお問い合わせください。

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