Versatile Rigid-Flexible PCBs: Perfect for High-Density Designs
Rigid-Flexible PCBs (Printed Circuit Boards) combine the best features of rigid and flexible circuit boards, providing both stability and flexibility in one integrated design. They consist of a rigid section and a flexible section, allowing them to be used in applications where both characteristics are needed.
Key Features:
- Hybrid Design: Combines rigid and flexible layers to offer both structural support and the ability to bend or twist.
- Space Efficiency: Ideal for compact and complex designs where space is at a premium.
- Enhanced Durability: Flexible sections can withstand vibrations and mechanical stress, while rigid sections provide stability and protection for sensitive components.
- Versatile Applications: Suitable for use in a variety of industries including consumer electronics, automotive, medical devices, and aerospace.
Benefits:
- Improved Reliability: Reduces the risk of solder joint failure and mechanical stress by incorporating flexible sections.
- Design Flexibility: Allows for more compact and creative designs by accommodating complex shapes and configurations.
- Reduced Assembly Complexity: Minimizes the need for additional connectors and interconnects, streamlining the assembly process.
PRODUCT INFO
1. Rigid Substrate Materials:
FR-4: A commonly used material made of woven glass fabric and epoxy resin. It provides good mechanical strength and thermal stability.
Thickness: Typically ranges from 0.4 mm to 3.2 mm.
Thermal Rating: Up to 130°C.
Dielectric Constant: Approximately 4.5.
High-Frequency Materials: Such as Rogers or Taconic laminates, used in applications requiring superior signal integrity.
Thickness: Varies based on application, typically around 0.8 mm to 2.0 mm.
Thermal Rating: Up to 180°C or higher.
Dielectric Constant: Ranges from 2.2 to 10.0, depending on the material.
2. Flexible Substrate Materials:
Polyimide (PI): A high-performance polymer known for its excellent thermal stability, flexibility, and chemical resistance.
- Thickness: Generally between 0.05 mm to 0.2 mm.
- Thermal Rating: Up to 250°C.
- Dielectric Constant: Approximately 3.0 to 3.5.
Polyester (PET): Another flexible material offering good mechanical properties and lower cost compared to polyimide.
- Thickness: Typically ranges from 0.1 mm to 0.2 mm.
- Thermal Rating: Up to 150°C.
- Dielectric Constant: Approximately 3.2 to 3.5.
3. Conductive Materials:
Copper Foil: Used for the conductive layers in both rigid and flexible sections.
- Thickness: Standard thicknesses include 1 oz/ft² (35 µm) to 2 oz/ft² (70 µm).
- Adhesion: Ensured by specialized bonding techniques, particularly in flexible sections.
4. Adhesives and Bonding Materials:
Polyimide Adhesives: Used to bond the flexible and rigid sections, offering high thermal and chemical resistance.
- Bonding Temperature: Typically requires curing at temperatures between 150°C to 250°C.
- Acrylic or Epoxy Adhesives: Used for certain applications where specific bonding characteristics are required.
- Bonding Temperature: Curing temperatures generally range from 80°C to 150°C.
5. Solder Mask and Surface Finishes:
Solder Mask: Protects the PCB and prevents solder from bridging between traces.
- Types: Typically available in green, black, or other colors, and can be applied to both rigid and flexible sections.
- Surface Finishes: Ensures good solderability and protection of exposed copper.
Options: Hot Air Solder Leveling (HASL), Electroless Nickel/Immersion Gold (ENIG), Organic Solderability Preservative (OSP), and others based on the application.
APPLICATIONS
Common Applications:
- Consumer Electronics: Used in smartphones, tablets, wearables, and other compact devices requiring both flexibility and durability.
- Automotive: Employed in complex dashboard assemblies, infotainment systems, and sensor modules.
- Medical Devices: Ideal for portable diagnostic equipment, implants, and flexible medical sensors.
- Aerospace: Suitable for avionics systems, satellite components, and other high-reliability applications.
Notes:
Design Considerations: Ensure proper design of flex-to-rigid transitions to avoid mechanical failure. Manufacturing: Requires specialized processes and materials to achieve optimal performance and reliability. Testing and Quality Control: Comprehensive testing is essential to ensure the integrity and performance of both rigid and flexible sections.
Advantages:
Enhanced Reliability: Reduces mechanical stress and solder joint failures with flexible connections. Design Flexibility: Allows for intricate and space-efficient designs that traditional rigid boards cannot achieve. Reduced Assembly Complexity: Integrates multiple functions into a single board, minimizing the need for additional connectors and reducing assembly time.
SHIPPING INFO
Delivery Time:
* 10 pieces: 14 days
* 600 pieces: 19 days
* 3000 pieces: 24 days
Packaging: Hard carton with bubble wrap, vacuum-sealed polybags
Sample Service: $0.4 each, customer covers delivery costs
Dimensions: 18 cm x 16 cm x 12 cm
Weight: 0.05 kg
Custom Orders: Available for 50+ pieces
Sunsoar is a professional PCB/PCBA factory offering high-quality, reliable products tailored to your needs. Contact us for details and custom orders.
